North American Production Sharing de México, S.A. de C.V.

SMT Engineer (Otay)

North American Production Sharing de México, S.A. de C.V.

Tijuana, Baja California

Marzo 05 2026

Compartir:

Giro

Maquiladora (Export.)

Actividad principal

Administración de maquiladoras.

Número de empleados

10000

Sitio Web corporativo

Datos de sucursal

*****@napsmexico.com

Vía Rápida Poniente 16955-58 Río Tijuana, 3ra. Etapa Tijuana, Baja California

Descripción y detalle de las actividades

Job description:


The Mission:

As our SMT Process Engineer, you are the technical architect of our PCBA (Printed Circuit Board Assembly) lines. You will own the entire SMT lifecycle—from initial programming and stencil design for New Product Introduction (NPI) to high-volume optimization. Your goal is to ensure the highest levels of placement accuracy, thermal profile stability, and overall line velocity.


Key Responsibilities: 

1. NPI & Mass Production Introduction (MPI)

  • Launch Leadership: Lead the Mass Production Introduction (MPI) for all new PCBA designs, ensuring a seamless transition from prototype to high-volume manufacturing.
  • Material Validation: Oversee the qualification of new solder pastes, components, and auxiliary materials (flux, stencils, feeders), documenting all validation reports and implementation results.

2. Process Architecture & Technical Documentation

  • Standardization: Create and maintain the "Engineering Bible" for SMT, including SOPs, Process Workflows, and machine maintenance regulations.
  • Thermal Profiling: Master the Reflow Oven profiling and wave soldering parameters to ensure structural integrity and long-term reliability.

3. Yield Optimization & Cost Control

  • Efficiency Engineering: Develop innovative solutions to reduce cycle times and improve Units Per Hour (UPH) through better line balancing and feeder optimization.
  • Scrap Mitigation: Drive aggressive yield improvement initiatives by analyzing AOI (Automated Optical Inspection) and SPI (Solder Paste Inspection) data to reduce dPMO (defects per million opportunities).

4. Technical Troubleshooting

  • Root Cause Analysis: Lead the diagnosis of SMT-specific defects (e.g., tombstoning, voiding, bridging) and implement permanent corrective actions.

Experiencia y requisitos

Job Requirements

  • Education: Bachelor’s degree in Electronics, Mechanical Engineering, or a related technical field.
  • Experience: 3+ years of hands-on experience in SMT Process Engineering. Startup experience is a major plus.


Technical Toolkit:

  • Proficiency in Electronic Circuits and Mechanical Drafting (AutoCAD/SolidWorks).
  • Expertise in Design of Experiments (DOE) for process validation.
  • Hands-on experience with SMT equipment (Pick-and-Place, Reflow, Screen Printers, and AOI/SPI).
  • Communication: Strong technical reporting skills. English proficiency is a significant advantage for collaborating with global design teams.

Beneficios

  • Beneficios de acuerdo a la LFT
  • Otros

Número de vacantes 1

Área Ingeniería

Contrato Permanente

Modalidad Presencial

Turno Diurno

Jornada Tiempo Completo

Horario
  • Tiempo completo

Estudios Carrera con título profesional

Inglés Hablado: Intermedio, Escrito: Intermedio

Disponibilidad p. viajar No