IC Failure Analysis Engineer - Foránea
North American Production Sharing de México, S.A. de C.V.
Qualifications: Bachelor's degree in Electrical Engineering, Microelectronics, Physics, or equivalent. 2+ years of chip-level Failure Analysis (e.g., physical failure analysis, electrical microscopy, nanoprobing) experience or related work experience. 2+ years working in a physical/chemical laboratory setting. Proficiency in various physical and electrical analysis techniques such as mechanical polishing, chemical delayering, SEM inspection, curve trace, thermal emission, photon emission, and OBIRCH/TIVA. Strong knowledge of semiconductor physics, semiconductor devices, circuitry analysis, and wafer fabrication processes. Experience in SEM-based nano-probing with EBIC, EBAC, and EBIRCH on planar, SOI, and FinFET technologies. Familiarity with SCAN logic, Memory BIST, and RF/Analog design strategies. Familiarity with reliability testing for device and packaging product qualification, including CDM, HBM, TLP, HTOL, BHAST, and BURN-IN. Excellent communication, organization, and project management skills. Ability to work in a laboratory environment and collaborate effectively with multi-functional teams. Quick learner and able to perform independent work. Flexible working hours, including weekend or midnight shifts.
Febrero 19 2025 en Tijuana