55 empleos en Sonora

Memory Yield Engineer - Foránea

North American Production Sharing de México, S.A. de C.V.

Desired Skillset/Experience: Experience with 2.5D and 3D STCO and pathfinding. 2.5D and 3D chip partition and dependencies on product KPI like performance, power, chip and beachfront area, chip-chip communication metrics, power grid, etc. System and/or chip-level architecture and physical design experience for 3D cache partitioning (a plus). Physical design experience with SoIC and/or CoWoS. Experience with 2.5D/3D IC design flow and PDK development. Familiarity with heterogeneous integration processes such as hybrid bonding, wafer bonding, TSV, backside metallization. Process development and/or system and product development experience with advanced technology (sub 4nm) and its PPAC assessment. Custom layout, svrf, scripting skills. Hands-on experience with DRC, LVS, PEX (a plus). Ability to work across teams and BUs. Ability to work without supervision and as part of a team. Most tasks do not have defined steps; simultaneous use of multiple mental abilities is generally required to determine the best approach. Advanced data analysis and interpretation skills are required. Requirements: Bachelor's degree in science, Engineering, or related field and 5+ years of AI relevant System and technology or related work experience. OR master's degree in science, Engineering, or related field and 4+ years of AI relevant System and technology or related work experience. OR PhD in Science, Engineering, or related field and 3+ years of AI relevant System and technology or related work experience.

Enero 19 2026 en Tijuana

Post Silicon Test Engineer - Foránea

North American Production Sharing de México, S.A. de C.V.

Preferred Qualifications Master’s Degree in Electrical, Electronics, Mecatronica, Computer Science or related fields. Experience with circuit design (e.g., digital, analog, RF), hardware engineering and hardware design (schematic capture and circuit simulation) or related fields >1 year of experience in product development, test validation and high-volume production activities related to System on Chip (SOC) - Compute, Data Center, Mobile, Automotive, IoT areas. VLSI technologies – Digital Design, CPU architecture and organization and Semiconductor process. Domain knowledge in one or more of these areas is a plus: CPU, Logic Test (ATPG), Memory, (SRAM, DRAM interfaces), High Speed Serdes, Sensor validation and its corresponding test methodologies. CMOS Analog, and Mixed-Signal circuits such as ADC, DAC, PLL, LDO, LNA, Mixers, Power Amplifiers, and their performance measurements. Experience handling measurement test equipment (oscilloscope, signal generator, spectrum analyzer, time interval analyzer, logic analyzer, network analyzer, ATE, Rohde & Schwarz). Experience with Python/C++/Java/Assembly/Embedded SW Design for test (DFT) techniques and structural tests such as Scan/ATPG, JTAG and memory BIST is a plus. Hands on experience with data analysis software (JMP, National Instruments, Exensio, etc.) is a plus. Experience with Automated Test Equipment: Advantest or Teradyne is a plus. Familiarity with ARM, Arduino, Microcontroller architecture is a plus and measurement instruments such as oscilloscopes, spectrum analyzers, RF tools, etc. ,2+ years’ experience utilizing schematic capture and circuit simulation software. Minimum Qualifications Education: Master’s - Computer Science, Bachelors – Electrical Engineering; PhD degrees is a plus.

Enero 19 2026 en Tijuana

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