ASIC DRAM circuit design - Foránea
North American Production Sharing de México, S.A. de C.V.
Minimum Qualifications: Experience with 2.5D and 3D STCO and pathfinding. Excellent understanding of generic and AI use case KPI dependency on process and system architecture involving 2.5D/3D chiplets and networking technologies. Good knowledge of heterogeneous architecture, 2.5D/3D integration schemes. Basic programming skills e.g., ability to model (e.g., in Python or other languages), system use case impact of 3D architectures, and integration schemes. Master's or PhD in Electrical Engineering, Computer Science, or a related field. Ability to work across teams and BUs. Ability to work without supervision and as part of a team. Most tasks do not have defined steps; simultaneous use of multiple mental abilities is generally required to determine the best approach. Advanced data analysis and interpretation skills are required. Education: Bachelor’s degree in science, Engineering, or related field and 5+ years of relevant heterogeneous System and technology or related work experience. OR master's degree in science, Engineering, or related field and 4+ years of heterogeneous System and technology or related work experience. OR PhD in Science, Engineering, or related field and 3+ years of heterogeneous System and technology or related work experience.
Enero 19 2026 en Tijuana
