82 empleos de Informática Sistemas Ti Programación Software

Manufacturing Software Engineer

Intuitive Surgical, S. de R.L de C.V.

Required Skills and Experience Passionate about technologies and love programming Able to map, develop, and test projects from inception to launch Exercises judgment in selecting methods, techniques and evaluation criteria for obtaining results Adaptable to dynamic requirements Enjoy the thrill of tackling large complex problems Good communication and can drive to resolution within constraints Excellent ability to communicate complex concepts to engineers in different functional areas Strong programming skill and experience (C#/python) Solid understanding of OOA/OOD/OOP/Design Patterns Detail-oriented team player Resourceful problem-solving machine Foster a strong sense of team with peers through solicitation of feedback and constructive contribution to review sessions Required Education and Training Bachelor’s or Master’s in Engineering (Software Engineering or Computer Science preferred) 4+ years of verifiable software development experience Experience developing robotic or electromechanical systems, including control systems Strong analytical, time management, interpersonal, listening, and communication skills English at an advanced professional level is a must (bilingual) Fully understand the Software Development Life Cycle (SDLC) Able to travel 10-20% of the time (Tourist Visa is Required) Working Conditions Able to work with computers and equipment over extended periods. Preferred Skills and Experience Familiarity with web technologies like RESTful API, Web services, HTML, CSS, AngularJS is a plus Familiarity with databases (SQL, No-SQL, etc.) Experience in medical device manufacturing or a regulated engineering environment Strong industry experience in architecture and development of scalable production quality systems Familiarity with Statistical Analysis, Six Sigma, and/or Statistical Process Control are a plus

Enero 21 2026 en Mexicali

Senior Salesforce Business Systems Analyst

Outset Medical Mexico

Requirements/Qualifications: 5+ years’ experience as a business systems analysis In-depth knowledge of the Salesforce.com platforms configuration, architecture, and implementation best practices, including experience with Sales Cloud, Service Cloud, and Salesforce Lightning Salesforce.com Certifications (e.g., Admin, Advanced Admin, Business Analyst, etc.). Knowledge of the Software Development Life Cycle process (SDLC); and Waterfall or Agile/Scrum methodologies Strong analytical, problem-solving, and troubleshooting skills and the ability to exercise mature judgment and structured decision-making Excellent communication, facilitation, and interpersonal skills; demonstrated ability to clearly communicate across all levels of the organization and effectively influence within a dynamic matrix environment Creative, flexible, and collaborative in approach to technical problem-solving Mastery of unit testing, software change management, and software release management Ability to manage a variety of constituencies with competing priorities, manage multiple tasks simultaneously, and thrive in a complex, fast-paced environment with multiple priorities Experience managing systems and data in compliance with regulatory requirements, (e.g. FDA, SOX, HIPAA). Desired Qualifications: BS or MS in Information Systems or other relevant degree Experience as a Product Owner in Scrum or Agile development environments. Knowledge of system and software quality assurance best practices and methodologies; experience with software validation in a GxP environment. Working knowledge of ERP Systems (e.g., QAD, SAP, NetSuite, etc.). Experience with middleware platforms such as Boomi, Mulesoft, Informatica. Experience working in the Medical Device or other regulated industries

Enero 19 2026 en Tijuana

Memory Yield Engineer - Foránea

North American Production Sharing de México, S.A. de C.V.

Desired Skillset/Experience: Experience with 2.5D and 3D STCO and pathfinding. 2.5D and 3D chip partition and dependencies on product KPI like performance, power, chip and beachfront area, chip-chip communication metrics, power grid, etc. System and/or chip-level architecture and physical design experience for 3D cache partitioning (a plus). Physical design experience with SoIC and/or CoWoS. Experience with 2.5D/3D IC design flow and PDK development. Familiarity with heterogeneous integration processes such as hybrid bonding, wafer bonding, TSV, backside metallization. Process development and/or system and product development experience with advanced technology (sub 4nm) and its PPAC assessment. Custom layout, svrf, scripting skills. Hands-on experience with DRC, LVS, PEX (a plus). Ability to work across teams and BUs. Ability to work without supervision and as part of a team. Most tasks do not have defined steps; simultaneous use of multiple mental abilities is generally required to determine the best approach. Advanced data analysis and interpretation skills are required. Requirements: Bachelor's degree in science, Engineering, or related field and 5+ years of AI relevant System and technology or related work experience. OR master's degree in science, Engineering, or related field and 4+ years of AI relevant System and technology or related work experience. OR PhD in Science, Engineering, or related field and 3+ years of AI relevant System and technology or related work experience.

Enero 19 2026 en Tijuana

Memory Yield Engineer - Foránea

North American Production Sharing de México, S.A. de C.V.

Desired Skillset/Experience: Experience with 2.5D and 3D STCO and pathfinding. 2.5D and 3D chip partition and dependencies on product KPI like performance, power, chip and beachfront area, chip-chip communication metrics, power grid, etc. System and/or chip-level architecture and physical design experience for 3D cache partitioning (a plus). Physical design experience with SoIC and/or CoWoS. Experience with 2.5D/3D IC design flow and PDK development. Familiarity with heterogeneous integration processes such as hybrid bonding, wafer bonding, TSV, backside metallization. Process development and/or system and product development experience with advanced technology (sub 4nm) and its PPAC assessment. Custom layout, svrf, scripting skills. Hands-on experience with DRC, LVS, PEX (a plus). Ability to work across teams and BUs. Ability to work without supervision and as part of a team. Most tasks do not have defined steps; simultaneous use of multiple mental abilities is generally required to determine the best approach. Advanced data analysis and interpretation skills are required. Requirements: Bachelor's degree in science, Engineering, or related field and 5+ years of AI relevant System and technology or related work experience. OR master's degree in science, Engineering, or related field and 4+ years of AI relevant System and technology or related work experience. OR PhD in Science, Engineering, or related field and 3+ years of AI relevant System and technology or related work experience.

Enero 19 2026 en Tijuana

Memory Yield Engineer - Foránea

North American Production Sharing de México, S.A. de C.V.

Desired Skillset/Experience: Experience with 2.5D and 3D STCO and pathfinding. 2.5D and 3D chip partition and dependencies on product KPI like performance, power, chip and beachfront area, chip-chip communication metrics, power grid, etc. System and/or chip-level architecture and physical design experience for 3D cache partitioning (a plus). Physical design experience with SoIC and/or CoWoS. Experience with 2.5D/3D IC design flow and PDK development. Familiarity with heterogeneous integration processes such as hybrid bonding, wafer bonding, TSV, backside metallization. Process development and/or system and product development experience with advanced technology (sub 4nm) and its PPAC assessment. Custom layout, svrf, scripting skills. Hands-on experience with DRC, LVS, PEX (a plus). Ability to work across teams and BUs. Ability to work without supervision and as part of a team. Most tasks do not have defined steps; simultaneous use of multiple mental abilities is generally required to determine the best approach. Advanced data analysis and interpretation skills are required. Requirements: Bachelor's degree in science, Engineering, or related field and 5+ years of AI relevant System and technology or related work experience. OR master's degree in science, Engineering, or related field and 4+ years of AI relevant System and technology or related work experience. OR PhD in Science, Engineering, or related field and 3+ years of AI relevant System and technology or related work experience.

Enero 19 2026 en Tijuana

Memory Yield Engineer - Foránea

North American Production Sharing de México, S.A. de C.V.

Desired Skillset/Experience: Experience with 2.5D and 3D STCO and pathfinding. 2.5D and 3D chip partition and dependencies on product KPI like performance, power, chip and beachfront area, chip-chip communication metrics, power grid, etc. System and/or chip-level architecture and physical design experience for 3D cache partitioning (a plus). Physical design experience with SoIC and/or CoWoS. Experience with 2.5D/3D IC design flow and PDK development. Familiarity with heterogeneous integration processes such as hybrid bonding, wafer bonding, TSV, backside metallization. Process development and/or system and product development experience with advanced technology (sub 4nm) and its PPAC assessment. Custom layout, svrf, scripting skills. Hands-on experience with DRC, LVS, PEX (a plus). Ability to work across teams and BUs. Ability to work without supervision and as part of a team. Most tasks do not have defined steps; simultaneous use of multiple mental abilities is generally required to determine the best approach. Advanced data analysis and interpretation skills are required. Requirements: Bachelor's degree in science, Engineering, or related field and 5+ years of AI relevant System and technology or related work experience. OR master's degree in science, Engineering, or related field and 4+ years of AI relevant System and technology or related work experience. OR PhD in Science, Engineering, or related field and 3+ years of AI relevant System and technology or related work experience.

Enero 19 2026 en Tijuana

Memory Yield Engineer - Foránea

North American Production Sharing de México, S.A. de C.V.

Desired Skillset/Experience: Experience with 2.5D and 3D STCO and pathfinding. 2.5D and 3D chip partition and dependencies on product KPI like performance, power, chip and beachfront area, chip-chip communication metrics, power grid, etc. System and/or chip-level architecture and physical design experience for 3D cache partitioning (a plus). Physical design experience with SoIC and/or CoWoS. Experience with 2.5D/3D IC design flow and PDK development. Familiarity with heterogeneous integration processes such as hybrid bonding, wafer bonding, TSV, backside metallization. Process development and/or system and product development experience with advanced technology (sub 4nm) and its PPAC assessment. Custom layout, svrf, scripting skills. Hands-on experience with DRC, LVS, PEX (a plus). Ability to work across teams and BUs. Ability to work without supervision and as part of a team. Most tasks do not have defined steps; simultaneous use of multiple mental abilities is generally required to determine the best approach. Advanced data analysis and interpretation skills are required. Requirements: Bachelor's degree in science, Engineering, or related field and 5+ years of AI relevant System and technology or related work experience. OR master's degree in science, Engineering, or related field and 4+ years of AI relevant System and technology or related work experience. OR PhD in Science, Engineering, or related field and 3+ years of AI relevant System and technology or related work experience.

Enero 19 2026 en Tijuana