Failure Analysis Engineer (Semiconductors)
North American Production Sharing de México, S.A. de C.V.
Required Skills & Qualifications Fast learner with the ability to work independently. Strong understanding of: Semiconductor physics. Device behavior and circuit analysis. Wafer fabrication processes. Proficiency in electrical and physical FA techniques such as: Mechanical polishing, chemical etching. SEM/EDX, curve trace. Thermal emission, photon emission, OBIRCH/TIVA. Familiarity with tester‑interface optical techniques: Soft Defect Localization. Laser Voltage Probing. Frequency mapping. Time‑resolved emission. Experience with SEM nano‑probing (EBIC, EBAC, EBIRCH) on planar, SOI, or FinFET technologies. Knowledge of SCAN, Memory BIST, RF/Analog circuits. Understanding of reliability tests: CDM, HBM, TLP, HTOL, BHAST, Burn‑In, etc. Strong communication, organization, and project management skills. Ability to work in a laboratory environment. Willingness to work flexible hours, including weekend or night shifts. Experience with scripting/programming (Python, automation scripts, Power BI, etc.). Minimum Qualifications Bachelor’s degree in Electrical Engineering, Microelectronics, Physics, or related field. 0–2 years of hands‑on semiconductor failure analysis or physical/chemical lab experience. Preferred Qualifications Master’s degree in Electrical Engineering, Microelectronics, Physics, or related field. 2+ years experience in chip‑level failure analysis. Skills in: Automated Test Equipment (ATE). Data analysis. Product reliability and development
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